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Power chips are connected to external circuits with product packaging, and their efficiency depends on the support of the packaging. In high-power scenarios, power chips are generally packaged as power components. Chip interconnection describes the electrical connection on the top surface area of the chip, which is normally aluminum bonding wire in standard components. ^ Traditional power component plan cross-section
Currently, industrial silicon carbide power modules still mainly use the packaging modern technology of this wire-bonded standard silicon IGBT module. They encounter troubles such as large high-frequency parasitical criteria, insufficient warmth dissipation capacity, low-temperature resistance, and not enough insulation stamina, which restrict making use of silicon carbide semiconductors. The screen of superb performance. In order to resolve these problems and completely exploit the massive possible benefits of silicon carbide chips, many new product packaging modern technologies and options for silicon carbide power modules have actually emerged recently.
Silicon carbide power module bonding technique
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have developed from gold cable bonding in 2001 to aluminum cord (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have actually developed from gold cords to copper cables, and the driving force is cost decrease; high-power gadgets have actually created from aluminum cords (strips) to Cu Clips, and the driving pressure is to enhance item performance. The better the power, the greater the demands.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging process that utilizes a strong copper bridge soldered to solder to connect chips and pins. Compared to typical bonding packaging approaches, Cu Clip modern technology has the complying with advantages:
1. The connection between the chip and the pins is made from copper sheets, which, to a particular level, changes the basic wire bonding method in between the chip and the pins. Therefore, a special bundle resistance worth, greater existing flow, and better thermal conductivity can be obtained.
2. The lead pin welding location does not need to be silver-plated, which can fully conserve the cost of silver plating and inadequate silver plating.
3. The item appearance is entirely constant with regular items and is mainly made use of in servers, mobile computer systems, batteries/drives, graphics cards, motors, power supplies, and other fields.
Cu Clip has two bonding techniques.
All copper sheet bonding method
Both the Gate pad and the Source pad are clip-based. This bonding approach is a lot more expensive and complicated, but it can achieve far better Rdson and much better thermal results.
( copper strip)
Copper sheet plus cable bonding approach
The resource pad makes use of a Clip technique, and eviction uses a Cord method. This bonding technique is a little less expensive than the all-copper bonding approach, conserving wafer location (applicable to very small entrance areas). The procedure is easier than the all-copper bonding technique and can get better Rdson and far better thermal impact.
Provider of Copper Strip
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